Track industry technology trends and develop packaging technology roadmaps for power modules.
Responsible for power module product definition and developing the power module product roadmap.
Lead the team to complete the pre-research of advanced packaging solutions and organize technical cooperation with universities and research institutes.
Lead the team to complete the technical development of advanced power modules, output design, and process files.
Support the product development team to finish product development and import to factory for mass production.
Hard skills
Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors.
More than 8 years of experience in power semiconductor packaging product development or technology research and development.
Experience in industry-leading product development and mass production is preferred.
Successful experience in SiC module development, with products achieving mass production status preferred.
Familiar with the overall situation of the semiconductor packaging industry and have good interpersonal relationships in the industry.
Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN.
Profound knowledge of packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect.
Passionate about engineering, with a strong spirit of innovation.
Familiar with power module design rules as well as simulation or structure design tools.
Proactive, with pioneering spirit and a good sense of internal and external client.
Good command of English written and oral communication skills.