Power Module Simulation Design Expert

Li Auto (Job via XING.com)

📍 Munich
💰 100.000–240.000 € brutto/Jahr
📑 Unbefristeter Vertrag
⏱ Vollzeit
📐 Engineering
💼 Professional

Branche

Energie-, Wasserversorgung & Entsorgung
Elektrotechnik, Feinmechanik & Optik

Aufgaben

  • Development of power module electromagnetic and circuit models including Spice model, optimizing power module electrical design, chip selection, and solving issues such as oscillation, current sharing, crosstalk, and circulation current.
  • Conduct thermal resistance simulation, flow resistance simulation, and various working condition temperature simulations of the power module, optimizing its thermal design.
  • Lead the power module packaging process simulation including warpage, thermal mechanical stress, mold flow simulation, and optimizing design and key process parameters.
  • Identify root causes for power module reliability issues using simulation methods and complete lifetime assessment models.
  • Continuously optimize the power module simulation platform, defining a fast, robust, and automated simulation workflow, improving model accuracy based on experimental results.
  • Track cutting-edge simulation theories and methods for power modules, utilizing AI and big data to enhance design and process development.

Hard skills

  • Bachelor's degree or above in Material Science, Microelectronics, Mechanical Engineering, Electrical Engineering, Power Electronics, or related fields.
  • Over 10 years of experience in power semiconductor product development, with at least 5 years in power module thermal simulation, stress & reliability simulation, electrical simulation, and mold flow simulation.
  • Solid theoretical foundation in microstructure, working principles, common failure modes, and power electronic circuits of power semiconductor devices such as Si, SiC, and GaN.
  • Familiarity with power module packaging structures, electrothermal characteristics, packaging processes, and testing methods and standards.
  • Proficiency in using ANSYS HFSS/Maxwell/Q3D/PSpice/LTSpice/Comsol/Fluent/ANSYS mechanical/Moldex3D and MATLAB/PYTHON for data processing and result analysis.
  • Excellent negotiation and problem-solving skills, proactive and creative mindset.
  • Proficient English communication and writing skills, with strong team coordination and communication abilities.
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