Track industry technology trends and define electrical design technology roadmaps for SiC power modules.
Cooperate with the team to complete the pre-research of advanced packaging solutions from an electrical design perspective.
Organize electrical technical cooperation with universities and research institutes.
Responsible for SiC power module electrical design, simulation, and verification of power module packaging.
Develop advanced electrical design techniques with strong competitiveness in the industry.
Solve difficult problems of power modules, such as oscillation, current sharing, system coupling, and module reliability.
Investigate and dynamically track forward-looking technology of power semiconductor packaging.
Develop SiC MOSFET chip simulation models and complete the simulation and verification of the dynamic characteristics of the chip model.
Responsible for power chip selection, chip requirement development, chip screening, and optimal patch strategy.
Complete the batch production introduction and verification of new chips.
Hard skills
Master's degree or above in microelectronics, power electronics, electrical engineering, mechanical electronics, or related majors.
More than 8 years of experience in electrical development or technology research and development of power semiconductor packaging.
Successful experience in electrical development of SiC modules, preferably with products achieving mass production status.
Familiar with the semiconductor packaging industry and possess good interpersonal relationships.
Solid theoretical foundation for the microstructure, working principles, common failure modes, and power electronic circuits of power semiconductor devices such as Si, SiC, and GaN.
Proficient in electromagnetic fields, circuits, power electronics, and basic principles of power devices.