Tracking SiC power module technology trends and defining the power module process technology roadmap.
Leading the team to complete pre-research of advanced process technologies and organizing technical cooperation with universities and research institutes.
Leading the team to develop advanced power module processes and output process files.
Supporting the product development team to finish product development and import to factory for mass production.
Supporting mass production process teams to solve major process issues and improve reliability and yield.
Hard skills
Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields.
More than 8 years of experience in power semiconductor packaging product development or technology research and development.
Experience in industry-leading product development and mass production is preferred.
Proficient in packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect.
Successful experience in SiC module development, particularly in achieving mass production status.
Benefits
Opportunity to work with a leading team in the power semiconductor industry.
Engagement in cutting-edge research and innovation in automotive grade SiC device packaging.
Chance to make a significant impact in the field of power semiconductors.